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Direct Wafer™ produces one wafer at a time so each wafer sees identical processing conditions, enabling more spatially uniform wafers with lower dislocation densities and impurities. This unique feature offers a roadmap for cell efficiencies above those offered by the conventional ingot casting and sawing wafer process.
Direct Wafer™ produces wafers in a controlled, environment, reducing wafer-to-wafer quality variations. The tighter distribution simplifies manufacturing operations and product offerings, reducing inventory costs and sales challenges.
BETTER AESTHETICS, ADDED FEATURES
1366 has an advanced texturing process for Direct Wafers™ that can be customized to meet customer needs for optimal front and back surfaces. Direct Wafers™ can be produced with a smooth back for better surface passivation and an advanced front texture for lower reflectance and a uniform, dark appearance.